Published May 1997 | Version v1
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Ultrasonic characterization of microwave joined silicon carbide/silicon carbide

Description

High frequency (50--150 MHz), ultrasonic immersion testing has been used to characterize the surface and interfacial joint conditions of microwave bonded, monolithic silicon carbide (SiC) materials. The high resolution ultrasonic C-scan images point to damage accumulation after thermal cycling. Image processing was used to study the effects of the thermal cycling on waveform shape, amplitude and distribution. Such information is useful for concurrently engineering material fabrication processes and suitable nondestructive test procedures

Availability note (English)

Available from INIS in electronic form; ALSO AVAILABLE FROM OSTI AS DE99001879; NTIS; US GOVT. PRINTING OFFICE DEP.

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Additional details

Publishing Information

Imprint Pagination
11 p.
Report number
KAPL-P--000157

Conference

Title
99. annual meeting of the American Ceramic Society
Dates
4-7 May 1997
Place
Cincinnati, OH (United States)

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
30035944
Subject category
S36: MATERIALS SCIENCE; S42: ENGINEERING;
Resource subtype / Literary indicator
Conference, Numerical Data
Descriptors DEI
ADHESIVES; EXPERIMENTAL DATA; IMAGE PROCESSING; JOINING; MICROWAVE HEATING; SILICON CARBIDES; THERMAL CYCLING; ULTRASONIC TESTING
Descriptors DEC
ACOUSTIC TESTING; CARBIDES; CARBON COMPOUNDS; DATA; FABRICATION; HEATING; INFORMATION; MATERIALS TESTING; NONDESTRUCTIVE TESTING; NUMERICAL DATA; SILICON COMPOUNDS; TESTING

Optional Information