Published April 1, 2021 | Version v1
Journal article

Preliminary Study on Electromagnetic Thermal Coupling Numerical Simulation Technology of Static Inductor

  • 1. School of Marine Engineering, Jimei University, Xiamen (China)
  • 2. School of Ocean and Civil Engineering, Jiangsu University of Science and Technology, Zhenjiang (China)

Description

In this paper, the load transfer analysis method is used. Firstly, the magnetic thermal coupling analysis model is established and the material parameters are determined in ANSYS software. Secondly, the direction of applied current is determined by studying the influence of current direction on the temperature field in the electrified wire. Then, the relationship between current frequency, current magnitude and temperature field and the change of temperature at typical points with time are studied respectively. Finally, the parameters of temperature field for high frequency induction heater to produce better plastic deformation are determined. The research content of this paper can provide a reference for the subsequent research of electromagnetic thermal structure coupling numerical simulation technology of mobile inductor. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/1865/2/022036

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
1865
Journal Issue
2
Journal Page Range
[9 p.]
ISSN
1742-6596

Conference

Title
International Conference on Advances in Optics and Computational Sciences (ICAOCS)
Dates
21-23 Jan 2021
Place
Ottawa (Canada)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
54098312
Subject category
S36: MATERIALS SCIENCE; S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Resource subtype / Literary indicator
Conference
Descriptors DEI
COMPUTER CODES; COMPUTERIZED SIMULATION; COUPLING; HEATERS; INDUCTION; PLASTICITY; SOLENOIDS; WIRES
Descriptors DEC
ELECTRIC COILS; ELECTRICAL EQUIPMENT; EQUIPMENT; MECHANICAL PROPERTIES; SIMULATION