Published 1987 | Version v1
Book Metadata-only

Multilevel metallization, interconnection, and contact technologies

Creators

Description

This book contains 23 selections. Some of the titles are: Blanket tungsten film formation by photo-enhanced and plasma-enhanced chemical vapor deposition; MoSi/sub x/ LPCDV from MOF/sub 6/ and SiH/sub 4/ at 120-3500C; Chemical and Electrical Analysis of P + Si Contacts; and Comparison of the Electrical Properties of Five Different Polymide Films

Additional details

Publishing Information

Publisher
The Electrochemical Society.
Imprint Place
Pennington, NJ (USA)
Imprint Pagination
268 p.

Conference

Title
Multilevel metallization, interconnection, and contact technologies.
Dates
19-24 Oct 1986.
Place
Boston, MA (USA).

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
20003456
Subject category
S42: ENGINEERING; S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CHEMICAL ANALYSIS; CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; ELECTRIC CONTACTS; ELECTRICAL PROPERTIES; FABRICATION; MOLYBDENUM FLUORIDES; MOLYBDENUM SELENIDES; PHOSPHORUS; PHYSICAL METALLURGY; REVIEWS; SILANES; SILICON; TUNGSTEN
Descriptors DEC
CHALCOGENIDES; CHEMICAL COATING; DEPOSITION; DOCUMENT TYPES; ELECTRICAL EQUIPMENT; ELEMENTS; EQUIPMENT; FLUORIDES; FLUORINE COMPOUNDS; HALIDES; HALOGEN COMPOUNDS; HYDRIDES; HYDROGEN COMPOUNDS; MATERIALS; METALLURGY; METALS; MOLYBDENUM COMPOUNDS; NONMETALS; PHYSICAL PROPERTIES; SELENIDES; SELENIUM COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS; SURFACE COATING; TRANSITION ELEMENT COMPOUNDS; TRANSITION ELEMENTS

Optional Information

Secondary number(s)
CONF-8610321--.