Published August 28, 2014 | Version v1
Journal article

Influence of a passivation layer on strain relaxation and lattice disorder in thin nano-crystalline Pt films during in-situ annealing

  • 1. Institut für Metallurgie, TU Clausthal, Robert-Koch-Str. 42, D38678 Clausthal-Zellerfeld (Germany)
  • 2. Institut für Ionenstrahlphysik und Materialforschung, Helmholtz-Zentrum Dresden-Rossendorf, Dresden (Germany)
  • 3. Laboratory for Developments and Methods, Paul-Scherrer-Institute, Villigen PSI (Switzerland)
  • 4. Institute for Applied Materials (IAM-ESS), Karlsruhe Institute of Technology, Eggenstein-Leopoldshafen (Germany)
  • 5. Clausthaler Zentrum für Materialtechnik, Leibnizstraße 9, D-38678 Clausthal-Zellerfeld (Germany)

Description

In this work we compared the relaxation of strain and lattice disorder in thin nano-crystalline Pt films for samples covered with a Si3N4 layer and samples without a cover layer, respectively. We measured thickness and interplanar distance of the Pt film by X-ray reflectometry and X-ray diffractometry during in-situ annealing using synchrotron radiation. The results show that strain and lattice disorder relaxation are impeded if the Pt film is sealed with a cover layer to suppress the creation of vacancies at the Pt surface. This emphasizes the postulated important role of the generation of vacancies at the free surface of thin metal films for strain relaxation during isothermal annealing. - Highlights: • Strain relaxation in nano-crystalline platinum films was investigated. • XRR and XRD measurements were carried out using synchrotron radiation. • In-situ annealing was performed at 130 °C and 210 °C. • Magnetron sputtered Pt films with and without a Si3N4-cover layer are compared. • Strain relaxation is slower and lattice disorder is higher for the covered samples

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2014.06.048

Additional details

Identifiers

DOI
10.1016/j.tsf.2014.06.048;
PII
S0040-6090(14)00712-3;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
565
Journal Page Range
p. 79-83
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.