Published March 12, 2007
| Version v1
Journal article
Formation of novel Si-fullerene compound materials using a high-density silicon-ion plasma
Creators
- 1. Department of Electronic Engineering, Tohoku University, Sendai, 980-8579 (Japan)
Description
A Si-Ar plasma is produced using a RF discharge by an internal coil, which is accompanied by DC sputtering, for the purpose of forming novel Si-fullerene compound materials. According to the analysis of the fullerene-C60 after Si-Ar plasma ion irradiation, mass peaks corresponding to Si-heterofullerenes (SiC59, Si2C58 and Si3C57) are observed. It was also found that the method of introducing sublimated C60 into the Si-Ar plasma using a C60-oven resulted in an increase in the formation efficiency of SiC59
Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2006.02.053;
- PII
- S0040-6090(06)00356-7;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 515
- Journal Issue
- 9
- Journal Page Range
- p. 4177-4181
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- 18. symposium on plasma science for materials
- Acronym
- SPSM 18
- Dates
- 28-29 Jun 2005
- Place
- Tokyo (Japan)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39022895
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ARGON; FULLERENES; IRRADIATION; PLASMA; PLASMA DENSITY; SILICON; SILICON IONS; SPUTTERING
- Descriptors DEC
- CARBON; CHARGED PARTICLES; ELEMENTS; FLUIDS; GASES; IONS; NONMETALS; RARE GASES; SEMIMETALS
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.