Published March 12, 2007 | Version v1
Journal article

Formation of novel Si-fullerene compound materials using a high-density silicon-ion plasma

  • 1. Department of Electronic Engineering, Tohoku University, Sendai, 980-8579 (Japan)

Description

A Si-Ar plasma is produced using a RF discharge by an internal coil, which is accompanied by DC sputtering, for the purpose of forming novel Si-fullerene compound materials. According to the analysis of the fullerene-C60 after Si-Ar plasma ion irradiation, mass peaks corresponding to Si-heterofullerenes (SiC59, Si2C58 and Si3C57) are observed. It was also found that the method of introducing sublimated C60 into the Si-Ar plasma using a C60-oven resulted in an increase in the formation efficiency of SiC59

Additional details

Identifiers

DOI
10.1016/j.tsf.2006.02.053;
PII
S0040-6090(06)00356-7;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
515
Journal Issue
9
Journal Page Range
p. 4177-4181
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
18. symposium on plasma science for materials
Acronym
SPSM 18
Dates
28-29 Jun 2005
Place
Tokyo (Japan)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39022895
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ARGON; FULLERENES; IRRADIATION; PLASMA; PLASMA DENSITY; SILICON; SILICON IONS; SPUTTERING
Descriptors DEC
CARBON; CHARGED PARTICLES; ELEMENTS; FLUIDS; GASES; IONS; NONMETALS; RARE GASES; SEMIMETALS

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.