Published January 2013 | Version v1
Journal article

SPT+-IGBT characteristics and optimization

  • 1. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029 (China)
  • 2. Jiangsu R and D Center for Internet of Things, Wuxi 214135 (China)

Description

A novel advanced soft punch through (SPT) IGBT signed as SPT+-IGBT is investigated. Static and dynamic characteristics are simulated based on the 1200 V device structure and adopted technology. Extensive research on the structure optimization of SPT+-IGBT is presented and discussed. Compared with the structure of conventional IGBT, SPT+-IGBT has a much lower collector—emitter saturation voltage and better switching characteristics. Therefore it is very suitable for applications blocking a voltage higher than 3000 V. In addition, due to the improvement of switching speed achieved by using a thinner chip, SPT+-IGBT is also very competitive in 1200 V and 1700 V applications. (semiconductor devices)

Availability note (English)

Available from http://dx.doi.org/10.1088/1674-4926/34/1/014005

Additional details

Publishing Information

Journal Title
Journal of Semiconductors
Journal Volume
34
Journal Issue
1
Journal Page Range
[4 p.]
ISSN
1674-4926

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
44061883
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
CHANNELING; ELECTRIC POTENTIAL; OPTIMIZATION; SATURATION; SEMICONDUCTOR DEVICES; SIMULATION