Published January 2013
| Version v1
Journal article
SPT+-IGBT characteristics and optimization
Creators
- 1. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029 (China)
- 2. Jiangsu R and D Center for Internet of Things, Wuxi 214135 (China)
Description
A novel advanced soft punch through (SPT) IGBT signed as SPT+-IGBT is investigated. Static and dynamic characteristics are simulated based on the 1200 V device structure and adopted technology. Extensive research on the structure optimization of SPT+-IGBT is presented and discussed. Compared with the structure of conventional IGBT, SPT+-IGBT has a much lower collector—emitter saturation voltage and better switching characteristics. Therefore it is very suitable for applications blocking a voltage higher than 3000 V. In addition, due to the improvement of switching speed achieved by using a thinner chip, SPT+-IGBT is also very competitive in 1200 V and 1700 V applications. (semiconductor devices)
Availability note (English)
Available from http://dx.doi.org/10.1088/1674-4926/34/1/014005Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Semiconductors
- Journal Volume
- 34
- Journal Issue
- 1
- Journal Page Range
- [4 p.]
- ISSN
- 1674-4926
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44061883
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CHANNELING; ELECTRIC POTENTIAL; OPTIMIZATION; SATURATION; SEMICONDUCTOR DEVICES; SIMULATION