Effect of covalent functionalization and phase change matrix on heat transfer across graphene/phase change material interfaces
Creators
- 1. Key Laboratory of Advanced Civil Engineering Materials, Ministry of Education, School of Materials Science and Engineering, Tongji University, Caoan Road 4800, Shanghai, 201804, People's Republic of (China)
Description
Owing to the superior thermal conductivity (TC) of graphene, graphene/phase change material (G/PCM) have the potential as the thermal interface materials (TIMs) dissipating heat for electronic packages. In this paper, the effect of three functional groups, i.e., hydroxyl (OH), carboxyl (COOH), butyl (C4H9) relative to pristine graphene (PG) and three PCM matrices, i.e., octadecane (OD), octadecanol (OA), stearic acid (SA), on the interfacial heat transfer between the PCM matrix and graphene was investigated by using molecular dynamic simulations. The simulation results show that the longer the chain of the covalent group, the stronger the van der Waals force will be, which will further enhance the interfacial coupling, and finally decrease the interface thermal resistance (ITR). For different PCM matrices, G/SA has the best heat transfer performance, followed by G/OA, and finally G/OD. The ITR of PG-OH/SA and PG-COOH/OA is remarkably reduced because the hydrogen bond formed by electrostatic attraction enhances the interfacial coupling. Additionally, based on the obtained ITR results and the effective medium theory, TC of G/PCM was studied. It was found that TC of PG/PCM increased as the volume fraction of the filler increased, and TC of PG/SA was always the largest, followed by PG/OA, and the smallest was PG/OD. At a filler volume fraction of 9%, PG-C4H9/PCM has the highest TC, followed by PG-COOH/PCM and PG-OH/PCM, and the smallest is PG/PCM. For different phase change matrices, TC of G/SA is generally the highest, followed by G/OA, and the lowest is G/OD. The high TC of PG-OH/SA and PG-COOH/OA is also due to enhanced interfacial coupling by hydrogen bonding.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.applthermaleng.2019.02.002Additional details
Identifiers
- DOI
- 10.1016/j.applthermaleng.2019.02.002;
- PII
- S135943111837011X;
Publishing Information
- Journal Title
- Applied Thermal Engineering
- Journal Volume
- 151
- Journal Page Range
- p. 38-45
- ISSN
- 1359-4311
- CODEN
- ATENFT
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54125048
- Subject category
- S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- COMPUTERIZED SIMULATION; COVALENCE; ELECTROSTATICS; FILLERS; GRAPHENE; HEAT; HEAT TRANSFER; HYDROGEN; HYDROXIDES; MATRICES; MOLECULAR DYNAMICS METHOD; OCTADECANOIC ACID; PERFORMANCE; PHASE CHANGE MATERIALS; THERMAL CONDUCTIVITY; VAN DER WAALS FORCES
- Descriptors DEC
- CALCULATION METHODS; CARBON; CARBOXYLIC ACIDS; ELEMENTS; ENERGY; ENERGY TRANSFER; HYDROGEN COMPOUNDS; MATERIALS; MONOCARBOXYLIC ACIDS; NONMETALS; ORGANIC ACIDS; ORGANIC COMPOUNDS; OXYGEN COMPOUNDS; PHYSICAL PROPERTIES; SIMULATION; THERMODYNAMIC PROPERTIES
Optional Information
- Copyright
- Copyright (c) 2019 Elsevier Ltd. All rights reserved.