Published November 2018 | Version v1
Journal article

Low temperature incorporation of selenium in Cu2ZnSnS4: Diffusion and nucleation

  • 1. Department of Physics, Center for Materials Science and Nanotechnology, University of Oslo, P.O.Box 1048, Blindern, N-0316 Oslo (Norway)
  • 2. Ångström Solar Center, Division of Solid State Electronics, Uppsala University, Uppsala, Uppland 75120 (Sweden)

Description

Highlights: • Three sulfide Cu2ZnSnS4 samples with different average grain sizes are fabricated. • Se is incorporated in sulfide Cu2ZnSnS4 by selenization at 337, 360 and 409 °C. • Grain boundary diffusion of Se is observed at 337 and 360 °C. • Nucleation and recrystallization of a Cu2ZnSn(Sx,Se1-x)4 phase is seen at 409 °C. • Sodium diffuses from the Cu2ZnSnS4/Mo interface to support recrystallization. - Abstract: Band gap grading of Cu2ZnSn(S,Se)4 (CZTSSe) solar cells can be achieved by varying the Sr = [S]/([S] + [Se]) ratio in the absorber layer with depth. One approach is a two-step annealing process where the absorber is first sulfurized to Cu2ZnSnS4 (CZTS) followed by selenization to form CZTSSe. However, once nucleation of CZTSSe initiates, the rapid interchange of S and Se limits the control over the Sr ratio with depth. Here, we have studied incorporation of Se into CZTS and observed the behavior of Se below and up to the nucleation temperature of CZTSSe. Se diffusion at 337 and 360 °C is dominated by grain boundary diffusion while some increase of Se is also seen in the region from 100 to 800 nm from the surface. After selenization at 409 °C, recrystallization is observed and CZTSSe grains are formed. The recrystallization is more rapid for a smaller average grain size and is facilitated by diffusion of Na from the back contact. The grain boundary diffusion is identified with secondary ion mass spectrometry measurements by measuring the accumulation in the CZTS/Mo interface for three samples with different average grain size.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2018.09.024

Additional details

Identifiers

DOI
10.1016/j.tsf.2018.09.024;
PII
S0040609018306230;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
665
Journal Page Range
p. 159-163
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.