Published March 1, 2018 | Version v1
Journal article

Investigation of Annealing Temperature on Copper Oxide Thin Films Using Sol-Gel Spin Coating Technique

  • 1. Faculty of Electrical Engineering, Universiti Teknologi Mara, 40450 Shah Alam, Selangor (Malaysia)

Description

Copper (II) Oxide or cupric oxide (CuO) is one of the well-known materials studied for thin films applications. This paper was studied on the effect of annealing temperature to CuO thin films using sol-gel method and spin coating technique. The solution was prepared by sol-gel method and the thin films were synthesized at various temperatures from 500°C to 700°C that deposited onto the quartz substrates. After the annealing process, the thin films were uniform and brownish black in colour. The measurements were performed by atomic force microscopy (AFM), surface profiler (SP), two-point probe and Ultraviolet-visible (UV-Vis-NIR) spectrometer. From the optical measurement, the band gap was estimated to be 1.44eV for sample annealed at 550°C. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1757-899X/340/1/012008

Additional details

Publishing Information

Journal Title
IOP Conference Series. Materials Science and Engineering (Online)
Journal Volume
340
Journal Issue
1
Journal Page Range
[9 p.]
ISSN
1757-899X

Conference

Title
6. International Conference on Electronic Devices, Systems and Applications 2017
Acronym
ICEDSA 2017
Dates
7-8 Aug 2017
Place
Kuching (Malaysia)