Beryllium-copper joining techniques for use on plasma-facing components
- 1. Sandia National Labs., Livermore, CA (United States)
- 2. Sandia National Labs., Albuquerque, NM (United States)
Description
Several technologies are being evaluated as methods of joining beryllium to copper for plasma facing components in fusion reactors. The mechanical and microstructural properties of these bonds are reviewed and compared with the requirements for the application. The prime candidate for the plasma facing material is S-65C grade beryllium. At present three copper alloys are being considered for the structural substrate and include an oxide dispersion strengthened copper (CU-Al2-O3) and two precipitation strengthened copper alloys (CuCrZr and CuNiBe). The three joining technologies presented in this study include inertia welding, electroplating and brazing. In the case of the brazed bond, the braze alloy is selected based on compatibility with the reactor design. Several brazing candidates have been discounted because of their transmutation products in the high neutron flux environment. The braze alloys used in this study were aluminum base. Of paramount concern in all methods of joining was the elimination of a reaction between beryllium and copper to form an intermetallic phase, the presence of which would severely degrade bond ductility
Additional details
Publishing Information
- Publisher
- Institute of Electrical and Electronics Engineers, Inc.
- Imprint Place
- Piscataway, NJ (United States)
- ISBN
- 0-7803-2970-8
- Imprint Title
- 1995 IEEE 16. symposium on fusion engineering. Volume 1
- Imprint Pagination
- 886 p.
- Journal Page Range
- p. 377-380.
Conference
- Title
- 16. IEEE/NPSS symposium on fusion engineering - seeking a new energy ERA (Sofe 95).
- Dates
- 1-5 Oct 1995.
- Place
- Champaign, IL (United States).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 28066914
- Subject category
- S36: MATERIALS SCIENCE; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- BERYLLIUM BASE ALLOYS; COPPER BASE ALLOYS; ELECTROPLATING; JOINING; JOINTS; MECHANICAL PROPERTIES; MICROSTRUCTURE; THERMONUCLEAR REACTOR MATERIALS
- Descriptors DEC
- ALLOYS; BERYLLIUM ALLOYS; COPPER ALLOYS; CRYSTAL STRUCTURE; DEPOSITION; ELECTRODEPOSITION; ELECTROLYSIS; FABRICATION; MATERIALS; PLATING; SURFACE COATING; TRANSITION ELEMENT ALLOYS
Optional Information
- Contract/Grant/Project number
- Contract AC04-94AL85000
- Funding organization
- USDOE, Washington, DC (United States).
- Secondary number(s)
- CONF-950905--.