Published August 15, 2011 | Version v1
Journal article

Void evolution in polycarbonate at elevated temperatures

  • 1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)
  • 2. Department of Biomedical Engineering, Yuanpei University, Hsinchu, Taiwan (China)

Description

The void evolution in polycarbonate (PC) at elevated temperatures was investigated. Internal cylindrical cracks and voids were induced in PC by Nd-YAG laser irradiation. During the annealing at temperatures of 177-197 deg. C, the spherical void grows to a maximum size, which then decreases, and is finally leveling off. A model of void evolution based on the evaporation and condensation mechanisms for growth and shrinkage is proposed. The theoretical predictions are in good agreement with the experimental data. The activation energies of evaporation and condensation processes are determined to be 477.31 and 611.49 kJ/mol, respectively.

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Applied Physics
Journal Volume
110
Journal Issue
4
Journal Page Range
p. 043511-043511.5
ISSN
0021-8979
CODEN
JAPIAU

Optional Information

Notes
(c) 2011 American Institute of Physics