Numerical investigation of diffusion induced coarsening processes in binary alloys
Creators
- 1. Chair of solid mechanics, University of Siegen, Paul-Bonatz-Strae 9-11, 57068 Siegen (Germany)
Description
Microscopic small solder joints are part of most microelectronic packages. They show a variety of micro-morphological changes such as decomposition into phases and phase coarsening. In order to analyze the evolution of the alloy by means of a diffusion theory of heterogeneous solid mixtures we apply an extended Cahn-Hilliard phase-field model. The Cahn-Hilliard equation involves a bipotential operator and, accordingly, fourth-order spatial derivatives. In our contribution we discretize the diffusion equation spatially by means of rational B-spline finite element basis functions. To illustrate the versatility of this approach numerical simulations of phase decomposition and coarsening controlled by diffusion and by mechanical loading are discussed and compared with experimental results.
Availability note (English)
Available from http://dx.doi.org/10.1088/1757-899X/10/1/012100Additional details
Identifiers
Publishing Information
- Journal Title
- IOP Conference Series. Materials Science and Engineering (Online)
- Journal Volume
- 10
- Journal Issue
- 1
- Journal Page Range
- [10 p.]
- ISSN
- 1757-899X
Conference
- Title
- 9. world congress on computational mechanics; 4. Asian Pacific congress on computational mechanics
- Dates
- 19-23 Jul 2010
- Place
- Sydney (Australia)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44023487
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ALLOYS; BINARY ALLOY SYSTEMS; COMPUTERIZED SIMULATION; DECOMPOSITION; DIFFUSION; DIFFUSION EQUATIONS; FINITE ELEMENT METHOD; LOADING; MIXTURES; MORPHOLOGICAL CHANGES; SOLDERED JOINTS
- Descriptors DEC
- ALLOY SYSTEMS; CALCULATION METHODS; CHEMICAL REACTIONS; DIFFERENTIAL EQUATIONS; DISPERSIONS; EQUATIONS; JOINTS; MATERIALS HANDLING; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; PARTIAL DIFFERENTIAL EQUATIONS; SIMULATION