Published July 2019 | Version v1
Journal article

Cluster adsorption and migration energetics on hcp Ti (0001) surfaces via atomistic simulations

  • 1. Laboratoire des Sciences des Matériaux des Milieux et de la Modélisation (LS3M), Faculté Polydisciplinaire de Khouribga, Univ. Hassan Ier, B.P.: 145, 25000 Khouribga (Morocco)
  • 2. Laboratoire des Sciences des Matériaux des Milieux et de la Modélisation (LS3M), Faculté Polydisciplinaire de Khouribga, Université Sultan Moulay Slimane, B.P.: 145, 25000 Khouribga (Morocco)
  • 3. Laboratoire de Physique de la Matière Condensée, Faculté des sciences Ben M'sik, Hassan II University of Casablanca, B.P. 7955, Casablanca (Morocco)

Description

Highlights: • The Ti adatom diffusion energy barrier on the Ti(0001) surface is ≤0.09 eV. • The adsorption energy of a Ti adatom on Ti (0001) is −2262 eV for hcp and is −2245 eV for fcc sites. • The dissociation energy oscillates with respect to cluster size. -- Abstract: We use the modified embedded atom method in the framework of molecular statics to investigate the energetics of Ti adatom and Tin (2 ≤ n ≤ 7) cluster adsorption and migration on hcp Ti(0001) surfaces. We have examined several parameters such as the lattice constant, elastic constants, the cohesive energy and the surface energy and we have found that the modified embedded atom method gives results in good agreement with experimental and other theoretical investigations. The Ti (0001) surface multilayer relaxation results show that the distance between the first and second layer is contracted by −5.0%, which is the usual phenomenon for low index metallic surfaces. In addition, the diffusion parameters such as adsorption energies and energy barriers for single-atom and bi-dimensional clusters were derived. These calculations show that the adsorption energy and the potential barrier increase when the cluster size increases indicating their mobility decreases. Which indicates that the mobility of the cluster decreases as the cluster grows.

Additional details

Identifiers

DOI
10.1016/j.tsf.2019.05.013;
PII
S0040609019302792;

Publishing Information

Journal Title
Thin Solid Films (Print)
Journal Volume
682
Journal Page Range
p. 99-108
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2019 Elsevier B.V. All rights reserved.