Published September 15, 2008 | Version v1
Journal article

YBCO growth on textured NiW substrates by TFA-MOD method

  • 1. Superconductivity Research Laboratory, ISTEC, 1-10-13, Shinonome, Koto-Ku, Tokyo 135-0062 (Japan)
  • 2. The Furukawa Electric Co., Ltd., 2-4-3, Okano, Nishi-ku, Yokohama-shi, Kanagawa Pref. 220-0073 (Japan)

Description

For production of low cost coated conductor tapes, the TFA-MOD (metal organic deposition using trifluoroacetates) process is one of the promising methods and textured NiW alloy substrates are expected to be a candidate for their substrates. However, the superconducting properties obtained on the NiW substrates are not high enough due to lack of understandings on YBCO grain growth on the NiW. In this work, MOD growth conditions such as molar ratio (Ba/Y) of the starting solution, the crystallization temperature and P (O2) (O2 partial pressure) especially on the NiW substrates were studied. Compositional effects of the starting solution on Ic values have a trend having the highest value at Ba/Y = 1.5, which is similar to those on IBAD substrates, though the Ic values of YBCO on NiW are lower. One of the differences between YBCO layers on NiW and IBAD could be explained by the significant difference in a-axis oriented grain growth. The higher temperature and/or the lower PO2 were required to suppress the nucleation for a-axis oriented grain growth on the NiW. 1 m-long RTR production exhibited the end-to-end Ic value of 221 A/cm w, which could be improved further by the optimization of the process conditions

Availability note (English)

Available from http://dx.doi.org/10.1016/j.physc.2008.05.285

Additional details

Identifiers

DOI
10.1016/j.physc.2008.05.285;
PII
S0921-4534(08)00305-5;

Publishing Information

Journal Title
Physica. C, Superconductivity
Journal Volume
468
Journal Issue
15-20
Journal Page Range
p. 1534-1536
ISSN
0921-4534
CODEN
PHYCE6

Conference

Title
20. international symposium on superconductivity
Acronym
ISS 2007
Dates
5-7 Nov 2007
Place
Tsukuba (Japan)

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.