Effect of deposition temperature of a-Si:H layer on the performance of silicon heterojunction solar cell
Creators
- 1. Beijing University of Technology, College of Materials Science and Engineering (China)
- 2. Chengdu R&D Center, Hanergy Thin Film Power Group Ltd. (China)
Description
Substrate temperature during intrinsic hydrogenated amorphous silicon (i-a-Si:H) passivation layer deposition by plasma enhanced chemical vapor deposition (PECVD) is found to be crucial for reaching high conversion efficiency (Eff) in a silicon heterojunction (SHJ) solar cell. Measurements from Fourier transform infrared (FTIR) and minority carrier lifetimes show that the good passivation properties of a-Si:H film deposited at lower substrate temperatures are achieved. The correlations between the optical and electrical properties of thin films and the performance of SHJ cells have been analyzed. Finally, a SHJ solar cell with an area of 242.5 cm2 was prepared at 210 °C, yielding a maximum cell conversion efficiency up to 23.3% with VOC of 741 mV, JSC of 38.49 mA/cm2 and FF of 82.0%.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Materials Science. Materials in Electronics
- Journal Volume
- 30
- Journal Issue
- 14
- Journal Page Range
- p. 13330-13335
- ISSN
- 0957-4522
- CODEN
- JSMEEV
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52024370
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CARRIER LIFETIME; CHEMICAL VAPOR DEPOSITION; DEPOSITS; ELECTRICAL PROPERTIES; FOURIER TRANSFORM SPECTROMETERS; HETEROJUNCTIONS; INFRARED SPECTRA; SILICON SOLAR CELLS; THIN FILMS
- Descriptors DEC
- CHEMICAL COATING; DEPOSITION; DIRECT ENERGY CONVERTERS; EQUIPMENT; FILMS; LIFETIME; MEASURING INSTRUMENTS; PHOTOELECTRIC CELLS; PHOTOVOLTAIC CELLS; PHYSICAL PROPERTIES; SEMICONDUCTOR JUNCTIONS; SOLAR CELLS; SOLAR EQUIPMENT; SPECTRA; SPECTROMETERS; SURFACE COATING
Optional Information
- Copyright
- Copyright (c) 2019 Springer Science+Business Media, LLC, part of Springer Nature