Published November 15, 2013 | Version v1
Journal article

Valence band offset and Schottky barrier at amorphous boron and boron carbide interfaces with silicon and copper

  • 1. Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124 (United States)
  • 2. Ocotillo Materials Laboratory, Intel Corporation, 4500 S. Dobson Road, Chandler, AZ 85248 (United States)

Description

In order to understand the fundamental charge transport in a-B:H and a-BX:H (X = C, N, P) compound heterostructure devices, X-ray photoelectron spectroscopy has been utilized to determine the valence band offset and Schottky barrier present at amorphous boron compound interfaces formed with (1 0 0) Si and polished poly-crystalline Cu substrates. For interfaces formed by plasma enhanced chemical vapor deposition of a-B4–5C:H on (1 0 0) Si, relatively small valence band offsets of 0.2 ± 0.2 eV were determined. For a-B:H/Cu interfaces, a more significant Schottky barrier of 0.8 ± 0.16 eV was measured. These results are in contrast to those observed for a-BN:H and BP where more significant band discontinuities (>1–2 eV) were observed for interfaces with Si and Cu.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2013.08.090

Additional details

Identifiers

DOI
10.1016/j.apsusc.2013.08.090;
PII
S0169-4332(13)01581-X;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
285
Journal Issue
Part B
Journal Page Range
p. 545-551
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.