Published April 2018 | Version v1
Journal article

Improvement of Seebeck coefficient in as-grown Bi2Te3-ySey electrodeposited films by the addition of additives and bath optimization

  • 1. Instituto de Micro y Nanotecnología, IMN-CNM,CSIC - CEI UAM+CSIC Isaac Newton, 8, E-28760, Tres Cantos, Madrid (Spain)
  • 2. Mechanical, Aerospace and Nuclear Engineering Department, Rensselaer Polytechnic Institute Troy, New York 12180 (United States)

Description

Bi2.0Te2.7Se0.3 is the most widely used thermoelectric n-type leg for large-scale cooling applications. However, as-grown electrodeposited Bi2Te3-ySey films typically have a Seebeck coefficient around a third of the bulk value, which sometimes can be improved with thermal annealings. In this work, we report as-grown Bi2Te3-ySey films having a Seebeck coefficient of approximately half the value of bulk without additional thermal treatments. All samples reported were deposited in baths containing no additives, sodium lignosulfonate (SLS), or both SLS plus ethylenediaminetetraacetic acid (EDTA) with a concentration of 1 M HNO3 (pH of 0 ± 0.1) and 0.6 M HNO3 (pH of 0.3 ± 0.1). For each scenario, the deposition was carried out at two different temperatures (0 °C and 5 °C). Seebeck values of −120 μV K−1 have been measured for as-grown films with an optimum morphology and stoichiometry (Bi2Te2.7Se0.3), which is ∼50% of the value obtained for this composition in bulk and the highest among as-grown electrochemically deposited films reported to date. These results are an incentive to revisit and further explore the chemistry behind the electrodeposition of bismuth telluride selenide films to improve the performance of electrodeposited thermoelectric films.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.electacta.2018.03.025

Additional details

Identifiers

DOI
10.1016/j.electacta.2018.03.025;
PII
S0013468618305139;

Publishing Information

Journal Title
Electrochimica Acta
Journal Volume
269
Journal Page Range
p. 490-498
ISSN
0013-4686
CODEN
ELCAAV

Optional Information

Copyright
Copyright (c) 2018 Elsevier Ltd. All rights reserved.