Published March 20, 2009 | Version v1
Journal article

Effect of strain rate on compressive behavior of Ti-based bulk metallic glass at room temperature

  • 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072 (China)

Description

Compressive deformation behavior of the Ti40Zr25Ni8Cu9Be18 bulk metallic glass was investigated over a wide strain rate ranging from 10-4 to 103 s-1 at room temperature. Fracture stress was found to increase and fracture strain decrease with increasing applied strain rate, which were due to the decrease of the density of shear bands. Serrated flow was observed at lower strain rate. The appearance of a large number of shear bands was probably associated with flow serration observed during compression. At high strain rates, the rate of shear band nucleation was not sufficient to accommodate the applied strain rate and thus caused an early fracture of the test sample. The positive strain rate dependence of compressive strength might be associated with the different microstructure on the atomic scale in the Ti-based amorphous matrix

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2008.04.043

Additional details

Identifiers

DOI
10.1016/j.jallcom.2008.04.043;
PII
S0925-8388(08)00655-5;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
472
Journal Issue
1-2
Journal Page Range
p. 214-218
ISSN
0925-8388
CODEN
JALCEU

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40052958
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
COMPRESSION; COMPRESSION STRENGTH; COPPER ALLOYS; DEFORMATION; FRACTURES; METALLIC GLASSES; MICROSTRUCTURE; NICKEL ALLOYS; SHEAR; STRAIN RATE; STRAINS; STRESSES; TEMPERATURE RANGE 0273-0400 K; TITANIUM ALLOYS; ZIRCONIUM ALLOYS
Descriptors DEC
ALLOYS; FAILURES; MECHANICAL PROPERTIES; TEMPERATURE RANGE; TRANSITION ELEMENT ALLOYS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.