Published April 2011 | Version v1
Journal article

Femtosecond laser machining of multi-depth microchannel networks onto silicon

  • 1. Center for Lasers and Plasmas in Advanced Manufacturing, University of Michigan at Ann Arbor, MI 48109 (United States)
  • 2. IMRA America Inc., Ann Arbor, MI 48105 (United States)

Description

Direct writing of multi-depth microchannel branching networks into a silicon wafer with femtosecond pulses at 200 kHz is reported. The silicon wafer with the microchannels is used as the mold for rapid prototyping of microchannels on polydimethylsiloxane. The branching network is designed to serve as a gas exchanger for use in artificial lungs and bifurcates according to Murray's law. In the development of such micro-fluidic structures, processing speed, machining range with quality surface, and precision are significant considerations. The scan speed is found to be a key parameter to reduce the processing time, to expand the machining range, and to improve the surface quality. By fabricating a multi-depth branching network as an example, the utilization of femtosecond pulses in the development of microfluidic devices is demonstrated

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/21/4/045027

Additional details

Identifiers

DOI
10.1088/0960-1317/21/4/045027;
PII
S0960-1317(11)75338-9;

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
21
Journal Issue
4
Journal Page Range
[8 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46024892
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
ACCURACY; BRANCHING RATIO; LASER BEAM MACHINING; LAYERS; PULSES; SILICON; SURFACES
Descriptors DEC
DIMENSIONLESS NUMBERS; ELEMENTS; MACHINING; SEMIMETALS