Femtosecond laser machining of multi-depth microchannel networks onto silicon
Creators
- 1. Center for Lasers and Plasmas in Advanced Manufacturing, University of Michigan at Ann Arbor, MI 48109 (United States)
- 2. IMRA America Inc., Ann Arbor, MI 48105 (United States)
Description
Direct writing of multi-depth microchannel branching networks into a silicon wafer with femtosecond pulses at 200 kHz is reported. The silicon wafer with the microchannels is used as the mold for rapid prototyping of microchannels on polydimethylsiloxane. The branching network is designed to serve as a gas exchanger for use in artificial lungs and bifurcates according to Murray's law. In the development of such micro-fluidic structures, processing speed, machining range with quality surface, and precision are significant considerations. The scan speed is found to be a key parameter to reduce the processing time, to expand the machining range, and to improve the surface quality. By fabricating a multi-depth branching network as an example, the utilization of femtosecond pulses in the development of microfluidic devices is demonstrated
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/21/4/045027Additional details
Identifiers
- DOI
- 10.1088/0960-1317/21/4/045027;
- PII
- S0960-1317(11)75338-9;
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 21
- Journal Issue
- 4
- Journal Page Range
- [8 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46024892
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ACCURACY; BRANCHING RATIO; LASER BEAM MACHINING; LAYERS; PULSES; SILICON; SURFACES
- Descriptors DEC
- DIMENSIONLESS NUMBERS; ELEMENTS; MACHINING; SEMIMETALS