Published January 25, 1977 | Version v1
Patent Open

Method and means of reducing erosion of components of plasma devices exposed to helium and hydrogen isotope radiation

Description

Surfaces of components of plasma devices exposed to radiation by atoms or ions of helium or isotopes of hydrogen can be protected from damage due to blistering by shielding the surfaces with a structure formed by sintering a powder of aluminum or beryllium and its oxide or by coating the surfaces with such a sintered metal powder. 7 claims

Availability note (English)

MF available from INIS under the Report Number.

Files

8345097.pdf

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Additional details

Additional titles

Augmented title (English)
Patent

Publishing Information

Imprint Pagination
6 p.
IPC:
Int. Cl.B22F3/00.
IPC
Int. Cl.B22F3/00.
Patent number
US patent document 4,004,890/A/

Optional Information

Notes
PAT-APPL-656,214.