Published December 2021 | Version v1
Journal article

In situ growth of submicron polypyrrole on NiTi alloy wire as electrodes for recoverable and flexible quasi-solid-state supercapacitors

  • 1. Key Laboratory of New Processing Technology for Nonferrous Metal and Materials (Ministry of Education), Guangxi Key Laboratory of Optical and Electronic Materials and Devices, Guilin University of Technology, Guilin 541004 (China)
  • 2. Department of Machine Intelligence and Systems Engineering, Faculty of Systems Science and Technology, Akita Prefectural University, Yurihonjo 015-0055 (Japan)
  • 3. Graduate School of Advanced Science and Technology, Japan Advanced Institute of Science and Technology, 1–1 Asahidai, Nomi, Ishikawa 923-1292 (Japan)
  • 4. College of Chemistry and Chemical Engineering, Yantai University, Yantai 264005 (China)

Description

Highlights: • A method for fabricating shape-memory supercapacitor was presented. • The quasi-solid-state SMSC device exhibited an energy density of 60.0 μWh cm−2. • After 200 shape recovery cycles, the SMSC capacitance retention remained 92.3%. -- Abstract: In recent years, wearable and flexible supercapacitors have attracted extensive attention. High energy density supercapacitors based on shape-memory materials can meet the requirements of recoverability and fatigue resistance. We fabricate a symmetric wire-based shape-memory supercapacitor (SMSC) by depositing polypyrrole (PPy) on NiTi shape-memory alloy wire as electrodes. The SMSC exhibits high flexibility and excellent shape-memory performance, which can quickly recover to its original shape in a few seconds with almost constant capacitance when heated to the deformation temperature (approximately 60 °C) at arbitrary shapes of deformation. Furthermore, the SMSC displays an ultrahigh areal energy density of 60.0 μWh cm−2 and represents excellent capacitance stability after multiple deformation/recovery processes. Considering its outstanding flexible ability and excellent electrochemical performance, the wire-based SMSC shows infinite potential in the application of flexible and wearable electronics.

Additional details

Identifiers

DOI
10.1016/j.jallcom.2021.161646;
PII
S0925838821030553;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
888
Journal Page Range
vp.
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2021 Elsevier B.V. All rights reserved.