Published November 1978 | Version v1
Report Restricted

Comparison of pulsed electron beam-annealed and pulsed ruby laser-annealed ion-implanted silicon

Description

Recently two new techniques, pulsed electron beam annealing and pulsed laser annealing, have been developed for processing ion-implanted silicon. These two types of anneals have been compared using ion-channeling, ion back-scattering, and transmission electron microscopy (TEM). Single crystal samples were implanted with 100 keV As+ ions to a dose of approx. 1 x 1016 ions/cm2 and subsequently annealed by either a pulsed Ruby laser or a pulsed electron beam. Our results show in both cases that the near-surface region has melted and regrown epitaxially with nearly all of the implanted As (97 to 99%) incroporated onto lattice sites. The analysis indicates that the samples are essentially defect free and have complete electrical recovery

Availability note (English)

MF available from INIS under the Report Number; Available from NTIS., PC A02/MF A01.

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Additional details

Additional titles

Augmented title (English)
100keV As"+

Publishing Information

Imprint Pagination
5 p.
Report number
CONF-781113--24

Conference

Title
5. conference on application of small accelerators.
Dates
6 - 8 Nov 1978.
Place
Denton, TX, USA.

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
10481785
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ANNEALING; ARSENIC; BACKSCATTERING; CRYSTAL LATTICES; DOPED MATERIALS; ELECTRON BEAMS; FABRICATION; ION IMPLANTATION; LASERS; SILICON; SILICON ARSENIDES
Descriptors DEC
AMPLIFIERS; ARSENIC COMPOUNDS; ARSENIDES; BEAMS; CRYSTAL STRUCTURE; ELEMENTS; HEAT TREATMENTS; LEPTON BEAMS; PARTICLE BEAMS; SCATTERING; SEMIMETALS; SILICON COMPOUNDS