Influence of Co on Si3N4 incorporation in electrodeposited Ni
- 1. Surface Engineering Division, National Aerospace Laboratories, Post Bag No. 1779, Bangalore 560017 (India)
Description
Electrocomposites are known to have improved hardness and wear resistance. Si3N4 possesses good wear resistance and low friction. However, its incorporation is observed to be poor in a Ni matrix. In the present study the influence of an inorganic additive cobalt, on the incorporation of Si3N4 particles in a Ni matrix has been investigated. The composites with cobalt contents varying from 14 to 100 wt.% were electrodeposited from sulphamate electrolyte. The coatings were characterized using optical, scanning electron microscope and X-ray diffraction studies. The extent of Si3N4 incorporation was correlated with the cobalt content. The structure, surface morphology and the microhardness of the composites were studied and a correlation between the particle content, cobalt content, and structure was attempted
Availability note (English)
Available from http://dx.doi.org/10.1016/j.jallcom.2008.01.120Additional details
Identifiers
- DOI
- 10.1016/j.jallcom.2008.01.120;
- PII
- S0925-8388(08)00170-9;
Publishing Information
- Journal Title
- Journal of Alloys and Compounds
- Journal Volume
- 469
- Journal Issue
- 1-2
- Journal Page Range
- p. 362-365
- ISSN
- 0925-8388
- CODEN
- JALCEU
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 40052771
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CERAMICS; COATINGS; COBALT; ELECTRODEPOSITION; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDES; WEAR RESISTANCE; X-RAY DIFFRACTION
- Descriptors DEC
- COHERENT SCATTERING; DEPOSITION; DIFFRACTION; ELECTROLYSIS; ELECTRON MICROSCOPY; ELEMENTS; HARDNESS; LYSIS; MECHANICAL PROPERTIES; METALS; MICROSCOPY; NITRIDES; NITROGEN COMPOUNDS; PNICTIDES; SCATTERING; SILICON COMPOUNDS; SURFACE COATING; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.