Published February 15, 2019 | Version v1
Journal article

Constitutive Modeling of the Hot Deformation Behavior in 6082 Aluminum Alloy

  • 1. Central South University, School of Material Science and Engineering (China)
  • 2. Suntown Technology Group Co., Ltd. (China)
  • 3. Guangdong Fenglu Aluminum Co., Ltd. (China)

Description

The hot compressive tests of 6082 aluminum alloy were conducted on a Gleeble-3500 thermomechanical simulator at temperature ranges of 380-530 °C and strain rate range of 0.01-10 s−1. The constitutive analysis and microstructural evolution of the alloy were investigated. It was indicated that the peak stress increased with increasing strain rate and decreasing temperature. Dynamic recovery and dynamic recrystallization lead to the softening behavior of the alloy. In order to characterize the flow behavior of this alloy, some models were established based on the experimental data including the phenomenological Arrhenius-type model, the physically based Estrin and Mecking (EM) model for work hardening and dynamic recovery, and the EM model, which was combined with the Avrami equation for dynamic recrystallization. An artificial neural network model was also established to predict the flow stress. The results indicate that the Arrhenius-type model is more simple and more efficient than the EM + Avrami model. Moreover, the well-trained ANN model has the best predicting performance.

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Materials Engineering and Performance
Journal Volume
28
Journal Issue
2
Journal Page Range
p. 981-994
ISSN
1059-9495
CODEN
JMEPEG

Conference

Title
2017 Materials Science and Technology Conference
Dates
8-12 Oct 2017
Place
Pittsburgh, PA (United States)

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
52010939
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ALUMINIUM ALLOYS; EQUATIONS; FLOW STRESS; NANOSTRUCTURES; NEURAL NETWORKS; SIMULATION; STRAIN HARDENING; STRAIN RATE
Descriptors DEC
ALLOYS; HARDENING; STRESSES

Optional Information

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Copyright (c) 2019 ASM International