Published October 2008 | Version v1
Journal article

Sample shape and temperature strongly influence the yield strength of metallic nanopillars

  • 1. Department of Materials Science and Engineering, Johns Hopkins University, 102 Maryland Hall, 3400 N. Charles Street, Baltimore, MD 21218 (United States)

Description

For bulk face-centered cubic metals in conventional tests, the effects of sample shape on the yield stress are negligibly small, and the strength dependence on temperature is very weak. Using molecular dynamics simulations, here we demonstrate marked differences in yield stress for Cu pillars with different cross-sectional geometries, or tested at different temperatures, when the sample dimensions are on the nanometer scale. The origin of this change in yield behavior from conventional bulk Cu is explained by analyzing dislocation emission from the surfaces and corners as the mechanism to mediate plasticity. Based on a systematic characterization of the surface structure, atomic-level stresses and strains, a local strain criterion is proposed for yielding in such nanoscale objects

Availability note (English)

Available from http://dx.doi.org/10.1016/j.actamat.2008.05.044

Additional details

Identifiers

DOI
10.1016/j.actamat.2008.05.044;
PII
S1359-6454(08)00405-9;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
56
Journal Issue
17
Journal Page Range
p. 4816-4828
ISSN
1359-6454
CODEN
ACMAFD

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40011155
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
DISLOCATIONS; FCC LATTICES; MOLECULAR DYNAMICS METHOD; NANOSTRUCTURES; PLASTICITY; SIMULATION; STRAINS; STRESSES; SURFACES; TEMPERATURE DEPENDENCE; YIELD STRENGTH
Descriptors DEC
CALCULATION METHODS; CRYSTAL DEFECTS; CRYSTAL LATTICES; CRYSTAL STRUCTURE; CUBIC LATTICES; LINE DEFECTS; MECHANICAL PROPERTIES

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.