Published 1991 | Version v1
Book

Proceedings of the 1991 ASME JSME thermal engineering joint conference

Description

This book is organized under the following headings: Boiling heat transfer; CHF/MHF in boiling heat transfer; Numerical simulation of two-phase flow; Multi-phase flow and heat transfer; Interfacial phenomena in two-phase flow; High-density packing of electronic components; General cooling of electronic equipment; Fundamentals of condensation

Availability note (English)

American Society of Mechanical Engineers, 345 East 47 St., New York, NY 10017 (United States).

Additional details

Additional titles

Subtitle (English)
Volume 2

Publishing Information

Publisher
American Society of Mechanical Engineers.
Imprint Place
New York, NY (United States)
ISBN
0-7918-0613-8
Imprint Pagination
500 p.

Conference

Title
3. American Society of Mechanical Engineers/Japan Society of Mechanical Engineers (ASME/JSME) thermal engineering conference.
Dates
17-22 Mar 1991.
Place
Reno, NV (United States).

Optional Information

Secondary number(s)
CONF-910375--.