Power supply with arc handling for high peak power magnetron sputtering
- 1. Advanced Energy Industries, Inc., 1625 Sharp Point Drive, Fort Collins, Colorado 80525 (United States)
Description
High power pulsed magnetron sputtering (HPPMS) can generate a dense plasma with high target material ion content, using essentially conventional magnetron sputtering equipment. However, process arcs, which generate macroparticles and target damage, are not avoidable due especially to imperfections in vacuum system hardware and target materials. Arc handling is required for practical application of HPPMS. An experimental power supply capable of peak powers up to 3 MW, peak currents to 3000 A, at discharge voltages reaching 2 kV has been designed and built. It has voltage ring-up capability for pulse by pulse plasma ignition. This power supply technology enables the practical application of a whole range of sputtering processes, based on pulsing magnetrons operating at high peak powers. Power supply performance for typical pulses and for arc handling at peak currents into the kiloamp range is shown with temporal current and voltage characteristics of the discharge for typical pulses and for arcing operation
Additional details
Identifiers
- DOI
- 10.1116/1.1688365;
Publishing Information
- Journal Title
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
- Journal Volume
- 22
- Journal Issue
- 4
- Journal Page Range
- p. 1415-1419
- ISSN
- 0734-2101
- CODEN
- JVTAD6
Conference
- Title
- 50. international AVS symposium and exhibition
- Dates
- 2-7 Nov 2003
- Place
- Baltimore, MD (United States)
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 36028035
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ELECTRIC POTENTIAL; MAGNETRONS; PEAK LOAD; PERFORMANCE; PLASMA ARC SPRAYING; PLASMA DENSITY; PLASMA PRODUCTION; POWER SUPPLIES; PULSES; SPUTTERING; VACUUM SYSTEMS
- Descriptors DEC
- DEPOSITION; ELECTRON TUBES; ELECTRONIC EQUIPMENT; EQUIPMENT; MICROWAVE EQUIPMENT; MICROWAVE TUBES; SPRAY COATING; SURFACE COATING
Optional Information
- Notes
- (c) 2004 American Vacuum Society.