Published September 9, 2005 | Version v1
Journal article

Atomic Layer Deposition - Process Models and Metrologies

  • 1. National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD 20899-8360 (United States)

Description

We report on the status of a combined experimental and modeling study for atomic layer deposition (ALD) of HfO2 and Al2O3. Hafnium oxide films were deposited from tetrakis(dimethylamino)hafnium and water. Aluminum oxide films from trimethyl aluminum and water are being studied through simulations. In this work, both in situ metrologies and process models are being developed. Optically-accessible ALD reactors have been constructed for in situ, high-sensitivity Raman and infrared absorption spectroscopic measurements to monitor gas phase and surface species. A numerical model using computational fluid dynamics codes has been developed to simulate the gas flow and temperature profiles in the experimental reactor. Detailed chemical kinetic models are being developed with assistance from quantum chemical calculations to explore reaction pathways and energetics. This chemistry is then incorporated into the overall reactor models

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
788
Journal Issue
1
Journal Page Range
p. 141-146
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
2005 international conference on characterization and metrology for ULSI technology
Dates
15-18 Mar 2005
Place
Richardson, TX (United States)

Optional Information

Notes
(c) 2005 American Institute of Physics