Published March 12, 2007
| Version v1
Journal article
Electron-temperature control by varying dc voltage to a mesh grid covered by thin film in plasmas
Creators
- 1. Department of Chemical Engineering, National College of Technology, Ichinoseki, Iwate 021-8511 (Japan)
- 2. Department of Electrical Engineering, Tohoku University, Sendai 980-8579 (Japan)
Description
We discuss theoretically how the resistance of a film deposited on the metal grid affects the efficiency of electron-temperature control by employing a grid-bias method, in which, by using a naked metal grid, the electron temperature decreases from 3.4 to 0.12 eV with a decrease in the grid potential from 40 to - 60 V, being accompanied by an electron-density increase from 0.6 x 109 cm-3 to 6.0 x 109 cm-3 at an argon gas pressure of 5.0 mTorr. The electron temperature can be varied even when the grid is covered with a film with finite resistance, although the range of electron temperature variation is restricted. This method is applicable to reactive plasmas in which grids are often covered by films with finite resistance
Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2006.02.049;
- PII
- S0040-6090(06)00352-X;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 515
- Journal Issue
- 9
- Journal Page Range
- p. 4094-4097
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- 18. symposium on plasma science for materials
- Acronym
- SPSM 18
- Dates
- 28-29 Jun 2005
- Place
- Tokyo (Japan)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39022890
- Subject category
- S36: MATERIALS SCIENCE; S42: ENGINEERING;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ARGON; CONTROL; ELECTRON DENSITY; ELECTRON TEMPERATURE; EV RANGE 01-10; GRIDS; MILLI EV RANGE; PLASMA; THIN FILMS
- Descriptors DEC
- ELECTRODES; ELEMENTS; ENERGY RANGE; EV RANGE; FILMS; FLUIDS; GASES; NONMETALS; RARE GASES
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.