Published July 31, 2015 | Version v1
Journal article

Structural properties of In2Se3 precursor layers deposited by spray pyrolysis and physical vapor deposition for CuInSe2 thin-film solar cell applications

  • 1. IMN, UMR 6502, Université de Nantes, 2 rue de la Houssinière, 44322 Nantes Cedex 3 (France)
  • 2. Department of Electrical Engineering (SEES), Cinvestav-Zacatenco, 2508 Av. IPN, 07360 Mexico City (Mexico)
  • 3. School of Information and Communication Engineering, 2066 Seobu-ro, Jangan-gu, 440-746 Suwon (Korea, Republic of)

Description

The structural properties of In2Se3 precursor thin films grown by chemical spray pyrolysis (CSP) and physical vapor deposition (PVD) methods were compared. This is to investigate the feasibility to substitute PVD process of CuInSe2 (CISe) films by CSP films as precursor layer, thus decreasing the production cost by increasing material-utilization efficiency. Both films of 1 μm thickness were deposited at the same substrate temperature of 380 °C. X-ray diffraction and Raman spectra confirm the formation of γ-In2Se3 crystalline phase for both films. The PVD and CSP films exhibited (110) and (006) preferred orientations, respectively. The PVD films showed a smaller full width at half maximum value (0.09°) compared with CSP layers (0.1°). Films with the same crystalline phase but with different orientations are normally used in the preparation of high quality CISe films by 3-stage process. Scanning electron microscope cross-section images showed an important difference in grain size with well-defined larger grains of size 1–2 μm in the PVD films as compared to CSP layers (600 nm). Another important characteristic that differentiates the two precursor films is the oxygen contamination. X-ray photoelectron spectroscopy showed the presence of oxygen in CSP films. The oxygen atoms could be bonded to indium by replacing Se vacancies, which are formed during CSP deposition. Taking account of the obtained results, such CSP films can be used as precursor layer in a PVD process in order to produce CISe absorber films. - Highlights: • To find the intricacies involved in spray pyrolysis (CSP) and physical vapor (PVD) deposition. • Comparison of CSP and PVD film formations — especially in structural properties. • Feasibility to substitute CSP (cheaper) films for PVD in the manufacturing process. • Decreasing the global production cost of Cu(In,Ga)Se2 devices in the 3-stage process

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2015.01.035

Additional details

Identifiers

DOI
10.1016/j.tsf.2015.01.035;
PII
S0040-6090(15)00069-3;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
587
Journal Page Range
p. 112-116
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
International conference on microelectronics and plasma technology 2014
Acronym
ICMAP 2014
Dates
8-11 Jul 2014
Place
Gunsan (Korea, Republic of)

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.