Published September 1, 2018 | Version v1
Journal article

Flow Field and Temperature Field in GaN-MOCVD Reactor Based on Computational Fluid Dynamics Modeling

  • 1. Key Lab of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 (China)
  • 2. State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100 (China)

Description

Metal organic chemical vapor deposition (MOCVD) growth systems are one of the main types of equipment used for growing single crystal materials, such as GaN. To obtain film epitaxial materials with uniform performance, the flow field and temperature field in a GaN-MOCVD reactor are investigated by modeling and simulating. To make the simulation results more consistent with the actual situation, the gases in the reactor are considered to be compressible, making it possible to investigate the distributions of gas density and pressure in the reactor. The computational fluid dynamics method is used to study the effects of inlet gas flow velocity, pressure in the reactor, rotational speed of graphite susceptor, and gases used in the growth, which has great guiding significance for the growth of GaN film materials. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0256-307X/35/9/098101

Additional details

Publishing Information

Journal Title
Chinese Physics Letters
Journal Volume
35
Journal Issue
9
Journal Page Range
[5 p.]
ISSN
0256-307X
CODEN
CPLEEU