Published December 2011
| Version v1
Journal article
The mechanisms of surface exfoliation in H and He implanted Si crystals
Creators
- 1. Groupe nMat, CEMES-CNRS, 29 rue J. Marvig, 31055 Toulouse (France)
- 2. PGCIMAT, Universidade Federal do Rio Grande do Sul, Porto Alegre (Brazil)
- 3. Laboratorio de Implantação Iônica, Universidade Federal do Rio Grande do Sul, 91501-970 Porto Alegre (Brazil)
- 4. Institut Pprime,UPR3346, CNRS-Université de Poitiers-ENSMA, BP30179, 86962 Futuroscope (France)
Description
We report on the exfoliation mechanisms in light gas implanted Si. Microstructure characterization, extensive statistical analysis and solid mechanics theory show that exfoliation is caused by microcracks growing close to equilibrium pressure for high fluences. For lower fluences, cracks evolve at under-equilibrium pressure and exfoliation relies on a coalescence mechanism assisted by cleavage. This provides long-range, collective and efficient stress relief for clusters of cracks, causing enhancement of the exfoliation. The physical processes are independent of the irradiation energy.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2011.09.012Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2011.09.012;
- PII
- S1359-6462(11)00538-0;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 65
- Journal Issue
- 12
- Journal Page Range
- p. 1045-1048
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 45024761
- Subject category
- S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- CLEAVAGE; COALESCENCE; CRACK PROPAGATION; CRACKS; CRYSTALS; FRACTURES; HYDROGEN; ION IMPLANTATION; IRRADIATION; SILICON; SOLIDS; STRESSES; SURFACES; VISIBLE RADIATION
- Descriptors DEC
- ELECTROMAGNETIC RADIATION; ELEMENTS; FAILURES; MICROSTRUCTURE; NONMETALS; RADIATIONS; SEMIMETALS
Optional Information
- Copyright
- Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.