Published December 2011 | Version v1
Journal article

The mechanisms of surface exfoliation in H and He implanted Si crystals

  • 1. Groupe nMat, CEMES-CNRS, 29 rue J. Marvig, 31055 Toulouse (France)
  • 2. PGCIMAT, Universidade Federal do Rio Grande do Sul, Porto Alegre (Brazil)
  • 3. Laboratorio de Implantação Iônica, Universidade Federal do Rio Grande do Sul, 91501-970 Porto Alegre (Brazil)
  • 4. Institut Pprime,UPR3346, CNRS-Université de Poitiers-ENSMA, BP30179, 86962 Futuroscope (France)

Description

We report on the exfoliation mechanisms in light gas implanted Si. Microstructure characterization, extensive statistical analysis and solid mechanics theory show that exfoliation is caused by microcracks growing close to equilibrium pressure for high fluences. For lower fluences, cracks evolve at under-equilibrium pressure and exfoliation relies on a coalescence mechanism assisted by cleavage. This provides long-range, collective and efficient stress relief for clusters of cracks, causing enhancement of the exfoliation. The physical processes are independent of the irradiation energy.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.scriptamat.2011.09.012

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2011.09.012;
PII
S1359-6462(11)00538-0;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
65
Journal Issue
12
Journal Page Range
p. 1045-1048
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
45024761
Subject category
S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
CLEAVAGE; COALESCENCE; CRACK PROPAGATION; CRACKS; CRYSTALS; FRACTURES; HYDROGEN; ION IMPLANTATION; IRRADIATION; SILICON; SOLIDS; STRESSES; SURFACES; VISIBLE RADIATION
Descriptors DEC
ELECTROMAGNETIC RADIATION; ELEMENTS; FAILURES; MICROSTRUCTURE; NONMETALS; RADIATIONS; SEMIMETALS

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.