Metallization and photolithographic processes and procedures for MC2730 RTG thermopile intraconnections

Processes and procedures were developed for applying the thin film tungsten electrical intraconnections to the MC2730 RTG ''one-dimensional'' thermopile. After polishing, the surface to be metallized was cleaned with a detergent/organic solvent procedure and then etched with hydrofluoric acid to minimize the oxide. Tungsten contacts were sputtered onto the thermopile and the individual contacts photolithographically defined using a negative acting photoresist in conjunction with a potassium ferricyanide etchant. The processes were used to process 89 thermopiles with an 80 percent effective yield