Published December 5, 2005 | Version v1
Journal article

Modeling and experimental verification of the 300 mm Ar anneal process

  • 1. Siltronic AG, Johannes, Hess-Strasse 24, 84489 Burghausen (Germany)
  • 2. Lehrstuhl SMF, BTU Cottbus, 03046 Cottbus (Germany)

Description

We demonstrate a new model for simulating thermal and gravitational induced stress appearing in state of the art 300 mm argon annealing processes. Purpose of this work is to predict the allowable ramp rates in a vertical batch furnace system. The gravitational induced bending stress is modeled by using methods from structural mechanics like common finite element modeling. Calculation of the important specular reflecting radiation component - transporting extra radiation energy to the wafer center between the spacing of two horizontally oriented wafers - was achieved by using finite volume methods known from fluid dynamics. A reduction of the total resolved shear stress could be determined from our model if specular reflection is taken into account and thus allowing higher ramp rates. We furthermore demonstrate new experimental data for the upper yield stress of 300 mm Si-ingots with different boron and nitrogen co-doping levels. Especially at high temperatures, the upper yield stress of high ohmic material drops down significantly thus making it necessary to use planar support geometries to diminish the gravitational induced bending stress

Additional details

Identifiers

DOI
10.1016/j.mseb.2005.08.103;
PII
S0921-5107(05)00470-8;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology
Journal Volume
124-125
Journal Page Range
p. 235-240
ISSN
0921-5107
CODEN
MSBTEK

Conference

Title
Materials science and device issues for future Si-based technologies
Acronym
E-MRS 2005, Symposium D
Dates
31 May - 3 Jun 2005
Place
Strasbourg (France)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37120644
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ANNEALING; ARGON; BENDING; BORON; COMPUTERIZED SIMULATION; FINITE ELEMENT METHOD; FLUID MECHANICS; ION IMPLANTATION; NITROGEN; REFLECTION; SHEAR; SILICON; STRESSES
Descriptors DEC
CALCULATION METHODS; DEFORMATION; ELEMENTS; FLUIDS; GASES; HEAT TREATMENTS; MATHEMATICAL SOLUTIONS; MECHANICS; NONMETALS; NUMERICAL SOLUTION; RARE GASES; SEMIMETALS; SIMULATION

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.