Published September 2018
| Version v1
Journal article
Thermal stress at a circular hole in cubic crystals under uniform heat flow
Creators
- 1. National Tsing Hua University, Department of Power Mechanical Engineering (China)
Description
Thermal stress at a circular hole in cubic crystals subjected to uniform heat flow is investigated. The influence of the medium inside the hole is taken into account; thermal conductivity and internal pressure inside the hole are specifically considered. Two different anisotropic responses in cubic crystals have been found, and their behaviors can be correlated with Zener's anisotropy factor of the material. Several cubic crystals including niobium, molybdenum, silicon, nickel, and copper are used to illustrate this finding.
Additional details
Identifiers
Publishing Information
- Journal Title
- Acta Mechanica
- Journal Volume
- 229
- Journal Issue
- 9
- Journal Page Range
- p. 3963-3969
- ISSN
- 0001-5970
- CODEN
- AMHCAP
INIS
- Country of Publication
- Austria
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50024480
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ANISOTROPY; COPPER; CRYSTALS; CUBIC LATTICES; HEAT FLUX; MOLYBDENUM; NICKEL; NIOBIUM; SILICON; THERMAL CONDUCTIVITY; THERMAL STRESSES
- Descriptors DEC
- CRYSTAL LATTICES; CRYSTAL STRUCTURE; ELEMENTS; METALS; PHYSICAL PROPERTIES; REFRACTORY METALS; SEMIMETALS; STRESSES; THERMODYNAMIC PROPERTIES; THREE-DIMENSIONAL LATTICES; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2018 Springer-Verlag GmbH Austria, part of Springer Nature