Published September 2018 | Version v1
Journal article

Thermal stress at a circular hole in cubic crystals under uniform heat flow

  • 1. National Tsing Hua University, Department of Power Mechanical Engineering (China)

Description

Thermal stress at a circular hole in cubic crystals subjected to uniform heat flow is investigated. The influence of the medium inside the hole is taken into account; thermal conductivity and internal pressure inside the hole are specifically considered. Two different anisotropic responses in cubic crystals have been found, and their behaviors can be correlated with Zener's anisotropy factor of the material. Several cubic crystals including niobium, molybdenum, silicon, nickel, and copper are used to illustrate this finding.

Additional details

Identifiers

Publishing Information

Journal Title
Acta Mechanica
Journal Volume
229
Journal Issue
9
Journal Page Range
p. 3963-3969
ISSN
0001-5970
CODEN
AMHCAP

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Copyright
Copyright (c) 2018 Springer-Verlag GmbH Austria, part of Springer Nature