Published March 15, 2004 | Version v1
Journal article

Low temperature, high growth rate epitaxial silicon and silicon germanium alloy films

Description

Epitaxial growth of silicon and silicon germanium alloy films on Si(1 0 0) substrates in an ASM Epsilon (registered) single wafer reactor system using trisilane and germane has been investigated. The results obtained reveal that it is possible to achieve epitaxial silicon and silicon germanium growth rates at 630 deg. C and below that are substantially higher than those possible using silane, while maintaining high quality crystalline structure. The films grown were characterized using Rutherford backscattering spectroscopy (RBS), high resolution X-Ray diffraction (HR-XRD), atomic force microscopy (AFM) and high resolution cross-sectional transmission electron microscopy (X-TEM)

Additional details

Identifiers

DOI
10.1016/j.apsusc.2003.08.067;
PII
S0169433203010535;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
224
Journal Issue
1-4
Journal Page Range
p. 41-45
ISSN
0169-4332
CODEN
ASUSEE

Conference

Title
1. international SiGe technology and device meeting - From materials and process technology to device and circuit technology
Acronym
ISTDM 2003
Dates
15-17 Jan 2003
Place
Nagoya (Japan)

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.