Published August 2008
| Version v1
Journal article
Track treeing mechanism and plastic zone in solid Part 1: Initial development of plastic zone
Description
After neutron exposure and chemical etching in advance, latent tracks of recoil nucleon develop into pits on CR39 surface. During electrochemical etching, plastic zone is formed at top of pits. Some pits develop into tree cracks in the initial stage of plastic zone development. Physical and mathematical model of crack and plastic zone is proposed; parameter of development free path of plastic zone is presented. Based on integration of elementary theories the stress analysis is build up; based on analyses of measured parameters, a set of common relations between parameters is obtained. Integrate parameter analysis and stress analysis, depth of plastic zone development, law and phenomenon in experimental data can be interpreted completely
Availability note (English)
Available from http://dx.doi.org/10.1016/j.radmeas.2008.03.031Additional details
Identifiers
- DOI
- 10.1016/j.radmeas.2008.03.031;
- PII
- S1350-4487(08)00124-8;
Publishing Information
- Journal Title
- Radiation Measurements
- Journal Volume
- 43
- Journal Issue
- suppl.1
- Journal Page Range
- p. S87-S90
- ISSN
- 1350-4487
- CODEN
- RMEAEP
Conference
- Title
- 23. international conference on nuclear tracks in solids
- Dates
- 11-15 Sep 2006
- Place
- Beijing (China)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 40008250
- Subject category
- S61: RADIATION PROTECTION AND DOSIMETRY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ELECTROCHEMISTRY; ETCHING; MATHEMATICAL MODELS; NEUTRONS; PARTICLE TRACKS; PLASTICS; SPECTROSCOPY; STRESS ANALYSIS
- Descriptors DEC
- BARYONS; CHEMISTRY; ELEMENTARY PARTICLES; FERMIONS; HADRONS; MATERIALS; NUCLEONS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; SURFACE FINISHING; SYNTHETIC MATERIALS
Optional Information
- Copyright
- Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.