Published August 2008 | Version v1
Journal article

Track treeing mechanism and plastic zone in solid Part 1: Initial development of plastic zone

Creators

  • 1. Chinese Nuclear Society, Postbox 2125, Beijing, 100045 (China)

Description

After neutron exposure and chemical etching in advance, latent tracks of recoil nucleon develop into pits on CR39 surface. During electrochemical etching, plastic zone is formed at top of pits. Some pits develop into tree cracks in the initial stage of plastic zone development. Physical and mathematical model of crack and plastic zone is proposed; parameter of development free path of plastic zone is presented. Based on integration of elementary theories the stress analysis is build up; based on analyses of measured parameters, a set of common relations between parameters is obtained. Integrate parameter analysis and stress analysis, depth of plastic zone development, law and phenomenon in experimental data can be interpreted completely

Availability note (English)

Available from http://dx.doi.org/10.1016/j.radmeas.2008.03.031

Additional details

Identifiers

DOI
10.1016/j.radmeas.2008.03.031;
PII
S1350-4487(08)00124-8;

Publishing Information

Journal Title
Radiation Measurements
Journal Volume
43
Journal Issue
suppl.1
Journal Page Range
p. S87-S90
ISSN
1350-4487
CODEN
RMEAEP

Conference

Title
23. international conference on nuclear tracks in solids
Dates
11-15 Sep 2006
Place
Beijing (China)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40008250
Subject category
S61: RADIATION PROTECTION AND DOSIMETRY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ELECTROCHEMISTRY; ETCHING; MATHEMATICAL MODELS; NEUTRONS; PARTICLE TRACKS; PLASTICS; SPECTROSCOPY; STRESS ANALYSIS
Descriptors DEC
BARYONS; CHEMISTRY; ELEMENTARY PARTICLES; FERMIONS; HADRONS; MATERIALS; NUCLEONS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; SURFACE FINISHING; SYNTHETIC MATERIALS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.