Published February 1, 2004 | Version v1
Journal article

Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder

  • 1. SRL-ISTEC, Morioka laboratory for Applied Superconductivity Technology (Japan)
  • 2. Faculty of Engineering, Iwate University (Japan)
  • 3. SRL-ISTEC, Bulk Superconductor Laboratory (Japan)

Description

Ag-added Y-Ba-Cu-O bulk superconductors were joined using Ag-added Er-Ba-Cu-O solder and different Er211 contents. Microstructural analysis revealed that the volume fraction of Er211 at the joint with a composition of Er123:Er211 = 4:1 was the same as that for the expected volume fraction of the initial composition. That is, this composition seems to be optimum, since the mass balance was maintained during the crystal growth from the initial growth stage to the final stage. The trapped-field distribution for the joint using this composition was uniform and the only single peak indicated that strong coupling was achieved

Availability note (English)

Available online at http://stacks.iop.org/0953-2048/17/S46/sust4_2_060.pdf or at the Web site for the journal Superconductor Science and Technology (ISSN 1361-6668) http://www.iop.org/

Additional details

Publishing Information

Journal Title
Superconductor Science and Technology
Journal Volume
17
Journal Issue
2
Journal Page Range
p. S46-S50
ISSN
0953-2048
CODEN
SUSTEF

Conference

Title
11. international workshop on critical currents
Acronym
IWCC 03
Dates
28-31 Jul 2003
Place
Tokyo (Japan)