Published May 21, 2011
| Version v1
Journal article
3D design activities at Fermilab-Opportunities for physics
Creators
- 1. Fermilab, P.O. Box 500, Batavia, IL 60510 (United States)
Description
Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.nima.2009.09.045Additional details
Identifiers
- DOI
- 10.1016/j.nima.2009.09.045;
- PII
- S0168-9002(09)01787-2;
Publishing Information
- Journal Title
- Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment
- Journal Volume
- 617
- Journal Issue
- 1-3
- Journal Page Range
- p. 375-377
- ISSN
- 0168-9002
- CODEN
- NIMAER
Conference
- Title
- 11. Pisa meeting on advanced detectors
- Dates
- 24-30 May 2009
- Place
- La Biodola, Elba (Italy)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 42009420
- Subject category
- S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- BONDING; DESIGN; HIGH ENERGY PHYSICS; INTEGRATED CIRCUITS; SILICON; VERTICAL INTEGRATION
- Descriptors DEC
- ELECTRONIC CIRCUITS; ELEMENTS; FABRICATION; JOINING; MICROELECTRONIC CIRCUITS; PHYSICS; SEMIMETALS
Optional Information
- Copyright
- Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.