Published June 1, 2019 | Version v1
Journal article

First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm−2

  • 1. INFN Firenze, via Sansone 1, Sesto Fiorentino, Firenze (Italy)
  • 2. INFN and University of Milano Bicocca and Physics Department, University of Milano Bicocca, Piazza della Scienza 3, Milano (Italy)
  • 3. INFN Torino and Physics Department, University of Torino, Via Pietro Giuria 1, Torino (Italy)
  • 4. INFN Pavia and Department of Engineering and Applied Sciences, University of Bergamo, Viale Marconi 5, Dalmine (Italy)
  • 5. INFN and Physics Department, University of Pisa, Largo B. Pontecorvo 3, Pisa (Italy)
  • 6. Instituto de Física de Cantabria, University of Cantabria—CSIC, Los Castros, Santander (Spain)
  • 7. TIFPA INFN and Department of Industrial Engineering, University of Trento, Via Sommarive 9, Trento (Italy)

Description

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R and D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.

Availability note (English)

Available from http://dx.doi.org/10.1088/1748-0221/14/06/C06018

Additional details

Publishing Information

Journal Title
Journal of Instrumentation
Journal Volume
14
Journal Issue
06
Journal Page Range
p. C06018
ISSN
1748-0221