Published October 2006 | Version v1
Journal article

Electromechanical properties of Ag/Bi2223 flat wire in a short thermocycle

  • 1. Department of Electrical and Electronic Engineering, University of Technology Petronas, UTP, 31750 Tronoh, Perak (Malaysia)
  • 2. Department of Materials Science and Engineering, Kyoto University, Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501 (Japan)

Description

An independently oxidized AgMn alloy is used to gauge the overall tensile strength of technical Ag/Bi2223 composite flat wire through the contributions of individual constituent strengthenings. Theoretical analysis based on the rule of mixtures shows similarity between measured and calculated curves of the composite at room temperature (RT) and 77 K. The elastic modulus of the composite wire, deduced from initial and loading/unloading curves, is found to be around 95-98 GPa, while for Bi2223 filaments, the modulus of elasticity was estimated to be 129 GPa. The effect of thermal cycling between RT and 77 K on the electromechanical properties of the wire is also examined. The critical current is significantly reduced by tensile strain above 0.4% but not affected by the short thermocycle when measured across different specimens. Finally, the relation between the fracture strain and the strain span of the Bi2223 filaments is found to accommodate an intrinsic filament fracture strain of about 0.04-0.11% in the wire

Availability note (English)

Available online at http://stacks.iop.org/0953-2048/19/1018/sust6_10_005.pdf or at the Web site for the journal Superconductor Science and Technology (ISSN 1361-6668) http://www.iop.org/

Additional details

Publishing Information

Journal Title
Superconductor Science and Technology
Journal Volume
19
Journal Issue
10
Journal Page Range
p. 1018-1022
ISSN
0953-2048
CODEN
SUSTEF