Published April 2010 | Version v1
Journal article

Improved dc characteristics of AlGaN/GaN HEMTs with Ti/Al/Ti/Ni/Au electrode schemes

  • 1. Korea University, Seoul (Korea, Republic of)
  • 2. Nano-bio and Medical Appliance Research Center, KETI, Seongnam (Korea, Republic of)

Description

We report on the electrical properties of AlGaN/GaN high-electron-mobility transistors (HEMTs) fabricated with Ti/Al/Ti/Ni/Au multilayer ohmic electrodes on Si substrates. The specific contact resistance of the proposed electrode is as low as 8.8 x 10-7 Ωcm2, 5.7 times lower than that of the conventional Ti/Al/Ni/Au electrode. AlGaN/GaN HEMTs with Ti/Al/Ti/Ni/Au ohmic electrodes show a high extrinsic transconductance of 104 mS/mm and a maximum current density of 346 mA/mm, which values are increased by 15.5% and 54%, respectively, as compared to those observed from the AlGaN/GaN HEMTs with Ti/Al/Ni/Au ohmic electrodes.

Additional details

Publishing Information

Journal Title
Journal of the Korean Physical Society
Journal Volume
56
Journal Issue
41
Series
19 refs, 6 figs, 1 tab
Journal Page Range
p. 1287-1290
ISSN
0374-4884