Nickel-plating for active metal dissolution resistance in molten fluoride salts

Ni electroplating of Incoloy-800H was investigated with the goal of mitigating Cr dissolution from this alloy into molten 46.5%LiF-11.5%NaF-42%KF eutectic salt, commonly referred to as FLiNaK. Tests were conducted in graphite crucibles at a molten salt temperature of 850 deg. C. The crucible material graphite accelerates the corrosion process due to the large activity difference between the graphite and the alloy. For the purposes of providing a baseline for this study, un-plated Incoloy-800H and a nearly pure Ni-alloy, Ni-201 were also tested. Results indicate that Ni-plating has the potential to significantly improve the corrosion resistance of Incoloy-800H in molten fluoride salts. Diffusion of Cr from the alloy through the Ni-plating does occur and if the Ni-plating is thin enough this Cr eventually dissolves into the molten salt. The post-corrosion test microstructure of the Ni-plating, particularly void formation was also observed to depend on the plating thickness. Diffusion anneals in a helium environment of Ni-plated Incoloy-800H and an Fe-Ni-Cr model alloy were also investigated to understand Cr diffusion through the Ni-plating. Further enhancements in the efficacy of the Ni-plating as a protective barrier against Cr dissolution from the alloy into molten fluoride salts can be achieved by thermally forming a Cr2O3 barrier film on the surface of the alloy prior to Ni electroplating.