Published June 2012 | Version v1
Journal article

Atomic scale investigation of Cr precipitation in copper

  • 1. University of Rouen, GPM, UMR CNRS 6634, BP 12, Avenue de l'Université, 76801 Saint-Etienne du Rouvray (France)
  • 2. Institut Universitaire de France 103, bd Saint-Michel, 75005 Paris (France)

Description

The early stage of chromium precipitation in copper was analyzed at the atomic scale by atom probe tomography (APT). Quantitative data about the precipitate size, three-dimensional shape, density, composition and volume fraction were obtained in a Cu–1Cr–0.1Zr (wt.%) commercial alloy aged at 713 K. Surprisingly, nanoscaled precipitates exhibit various shapes (spherical, plates and ellipsoid) and contain a large amount of Cu (up to 50%), in contradiction to the equilibrium Cu–Cr phase diagram. APT data also show that some impurities (Fe) may segregate along Cu/Cr interfaces. The concomitant evolution of the precipitate shape and composition as a function of the aging time is discussed. Special emphasis is given to the competition between interfacial and elastic energy, and to the role of Fe segregation.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.actamat.2012.01.038

Additional details

Identifiers

DOI
10.1016/j.actamat.2012.01.038;
arXiv
arXiv:1207.3640v1;
PII
S1359-6454(12)00076-6;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
60
Journal Issue
11
Journal Page Range
p. 4575-4585
ISSN
1359-6454
CODEN
ACMAFD

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
43114834
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
AGING; ALLOYS; CHROMIUM; COPPER; DIFFUSION; IMPURITIES; INTERFACES; PHASE DIAGRAMS; PRECIPITATION; SEGREGATION; SHAPE; TOMOGRAPHY
Descriptors DEC
DIAGNOSTIC TECHNIQUES; DIAGRAMS; ELEMENTS; INFORMATION; METALS; SEPARATION PROCESSES; TRANSITION ELEMENTS

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.