A two-step sealing-and-reinforcement SU8 bonding paradigm for the fabrication of shallow microchannels

Adhesive bonding is a key technique to create microfluidic devices when two separate substrates are used to form microchannels. Among many adhesives explored in microchannel fabrication, SU8 has been widely used as an adhesive layer for sealing the microchannel sidewalls. The majority of the available SU8-based bonding methods, however, suffer from the difficulties associated with sealing of two important types of the microchannel architecture: (1) shallow microchannels with small patterns on a large area, and (2) microchannels with ultra-low aspect ratios (e.g. 6 mm in width and $2\mu$m in height). In this paper, a new bonding paradigm based upon the low-temperature and low-pressure SU8 bonding, consisting of two steps of sealing using a thin-SU8-coated PET film and bonding reinforcement using a SU8-coated glass slide, is proposed to resolve the aforementioned difficulties. Since it does not need complicated instruments such as a wafer bonding machine and a lamination device, the developed bonding paradigm is convenient and economical. We successfully demonstrate the compatibility of the proposed bonding paradigm with the two microchannel fabrication approaches based on the glass wet etching and the SU8 photo-lithography, where small microchannels with the innermost surfaces fully made of SU8 are obtained. A theoretical model is employed to better investigate the flow characteristics and the structural behavior of the microchannel including the PET film deformation, strain and von Mises stress distributions, bonding strength, etc. Moreover, we demonstrate the fabrication of the multi-height deep–shallow microchannel sidewalls and their sealing using the SU8-coated PET film. Finally, as a proof-of-concept device, a microfluidic filter consisting of the double-height deep–shallow microchannel is fabricated for separation of 3 µm and 10 µm particles. (paper)