Published August 2019 | Version v1
Journal article

Fabrication of high-aspect-ratio micropatterns in soluble block-copolymer polyimides by a UV-assisted thermal imprint process

  • 1. National Institute of Advanced Industrial Science and Technology (AIST), Ubiquitous MEMS and Micro Engineering Research Center (UMEMSME) (Japan)
  • 2. River Eletec Corporation, Research and Development Department (Japan)

Description

High-aspect-ratio microstructures (HARMS) of polyimides have many applications, such as components of microelectromechanical systems and X-ray gratings. This study demonstrates the fabrication of HARMS with vertical and smooth sidewalls in a thick, soluble block-copolymer polyimide (SBCP) film by an UV-assisted thermal imprint process. A preheating condition was controlled as a parameter that dominated the imprint pattern fidelity. After investigating a proper prebaking condition, patterns with a width of 3.4 μm and a height of 35.1 μm with a high-aspect ratio of 10 were successfully structured in an SBCP film that has a thickness of approximately a hundred micrometers. The process has potential as a low-cost fine pattern fabrication process for polyimide-based polymers.

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Mechanical Science and Technology
Journal Volume
33
Journal Issue
8
Journal Page Range
p. 3755-3760
ISSN
1738-494X

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
54085530
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
ASPECT RATIO; COPOLYMERS; HEAT TREATMENTS; MEMS; MICROSTRUCTURE; THICKNESS; THIN FILMS; X RADIATION
Descriptors DEC
DIMENSIONLESS NUMBERS; DIMENSIONS; ELECTROMAGNETIC RADIATION; FILMS; IONIZING RADIATIONS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; POLYMERS; RADIATIONS

Optional Information

Copyright
Copyright (c) 2019 KSME & Springer