Fabrication of high-aspect-ratio micropatterns in soluble block-copolymer polyimides by a UV-assisted thermal imprint process
Creators
- 1. National Institute of Advanced Industrial Science and Technology (AIST), Ubiquitous MEMS and Micro Engineering Research Center (UMEMSME) (Japan)
- 2. River Eletec Corporation, Research and Development Department (Japan)
Description
High-aspect-ratio microstructures (HARMS) of polyimides have many applications, such as components of microelectromechanical systems and X-ray gratings. This study demonstrates the fabrication of HARMS with vertical and smooth sidewalls in a thick, soluble block-copolymer polyimide (SBCP) film by an UV-assisted thermal imprint process. A preheating condition was controlled as a parameter that dominated the imprint pattern fidelity. After investigating a proper prebaking condition, patterns with a width of 3.4 μm and a height of 35.1 μm with a high-aspect ratio of 10 were successfully structured in an SBCP film that has a thickness of approximately a hundred micrometers. The process has potential as a low-cost fine pattern fabrication process for polyimide-based polymers.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Mechanical Science and Technology
- Journal Volume
- 33
- Journal Issue
- 8
- Journal Page Range
- p. 3755-3760
- ISSN
- 1738-494X
INIS
- Country of Publication
- Korea, Republic of
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54085530
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ASPECT RATIO; COPOLYMERS; HEAT TREATMENTS; MEMS; MICROSTRUCTURE; THICKNESS; THIN FILMS; X RADIATION
- Descriptors DEC
- DIMENSIONLESS NUMBERS; DIMENSIONS; ELECTROMAGNETIC RADIATION; FILMS; IONIZING RADIATIONS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; POLYMERS; RADIATIONS
Optional Information
- Copyright
- Copyright (c) 2019 KSME & Springer