Published November 1, 2019 | Version v1
Journal article

A plastic model based on the bounding surface formulation for cyclic behavior of soil

  • 1. College of Civil and Transportation Engineering, Hohai University, Nanjing 210098 (China)
  • 2. School of Earth Science and Engineering, Hohai University, Nanjing 210098 (China)

Description

Cyclic behavior of saturated soil under cyclic loading, such as earthquake, is one significant cause of the strain accumulation which can lead to the foundation destruction. This paper presents the relationship between hardening rules in the multi-surface plasticity and hardening function in the bounding surface plasticity, because both of them need to calculate the plastic modulus at every current stress state, applying the newly developed hardening rule into the hardening function to calculate the variable plastic modulus, this new idea adds the adversity of plasticity model, and a new bounding surface is established. The simulation result of undrained triaxial test verified the reliability of the new bounding surface model. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1755-1315/362/1/012126

Additional details

Publishing Information

Journal Title
IOP Conference Series: Earth and Environmental Science (Online)
Journal Volume
362
Journal Issue
1
Journal Page Range
[10 p.]
ISSN
1755-1315

Conference

Title
World Multidisciplinary Earth Sciences Symposium
Acronym
WMESS 2019
Dates
9-13 Sep 2019
Place
Prague (Czech Republic)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
53070290
Subject category
S58: GEOSCIENCES; S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
COMPUTERIZED SIMULATION; EARTHQUAKES; HARDENING; PLASTICITY; PLASTICS; RELIABILITY; SOILS; SURFACES
Descriptors DEC
MATERIALS; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; SEISMIC EVENTS; SIMULATION; SYNTHETIC MATERIALS