Published October 1, 2015 | Version v1
Journal article

The effect of Cu doping concentration on resistive switching of HfO2 film

Description

Graphical abstract: - Highlights: • The Cu doped and undoped HfO2 films were fabricated. • The improved RS behaviors were observed for Cu doped HfO2 film with BRS. • The 9.7% doped HfO2:Cu film showed both BRS and URS behaviors. • The related switching mechanisms were illustrated. - Abstract: The Cu-doped and undoped HfO2 films were fabricated and the effect of Cu doping concentration on resistive switching (RS) of HfO2 film was demonstrated. The X-ray photoelectron spectroscopy (XPS) was carried out to investigate the chemical bonding states of Cu in HfO2:Cu film. The improved RS behaviors in terms of ON/OFF ratio and switching parameters were observed for Cu-doped HfO2 film with bipolar resistive switching (BRS) behavior. With the increase of Cu doping concentration, the 9.7% Cu-doped HfO2 film showed both BRS and unipolar resistive switching (URS) behaviors with large operating voltages. The space charge limited current (SCLC) effect was proposed to interpret the switching mechanism of HfO2:Cu films with BRS behavior and the URS behavior can be explained by the migration of Cu ions

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2015.05.176

Additional details

Identifiers

DOI
10.1016/j.apsusc.2015.05.176;
PII
S0169-4332(15)01317-3;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
351
Journal Page Range
p. 704-708
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.