Experimental and numerical analysis on the adhesive T-joint using high temperature adhesive
- 1. School of Mechatronic Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, 02600 Arau, Perlis, Malaysia. (Malaysia)
Description
The adhesive T-joint is most widely used in automotive, aircraft and fluidization bed system. In order to determine the effect of the temperature and adhesive thickness on the joint strength, a series of a tensile test and numerical analysis were conducted in this study. The T-joint specimens were fabricated using 304 stainless steel plate (SS 304), 304 stainless steel perforated plate and high-temperature epoxy adhesive. The series of adhesive T-joints with different adhesive thicknesses (0.5, 1.0, 1.5 and 2.0 mm) were tested in tension loading at room temperature (RT) and elevated temperature (55 °C, 75 °C, 100 °C and 125 °C). Additionally, the T-joint structure was modelled, simulated and analysed for stress assessment to predict the strength of adhesive T-joint at the various temperature and adhesive thicknesses. The average failure stress decreases with the increasing of the temperature. Nevertheless, the failure stress of the T-joint decreased with the increasing of the adhesive thickness. The finite element prediction for T-joint strength is in a good agreement with the experimental failure stress results. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/1757-899X/429/1/012093Additional details
Identifiers
Publishing Information
- Journal Title
- IOP Conference Series. Materials Science and Engineering (Online)
- Journal Volume
- 429
- Journal Issue
- 1
- Journal Page Range
- [5 p.]
- ISSN
- 1757-899X
Conference
- Title
- International Conference on Advanced Manufacturing and Industry Applications
- Dates
- 15-17 Aug 2018
- Place
- Sarawak (Malaysia)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 52099543
- Subject category
- S36: MATERIALS SCIENCE; S42: ENGINEERING;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ADHESIVES; COMPUTERIZED SIMULATION; EPOXIDES; FINITE ELEMENT METHOD; FLUIDIZATION; NUMERICAL ANALYSIS; PLATES; STAINLESS STEEL-304
- Descriptors DEC
- ALLOYS; AUSTENITIC STEELS; CALCULATION METHODS; CARBON ADDITIONS; CHROMIUM ALLOYS; CHROMIUM-NICKEL STEELS; CORROSION RESISTANT ALLOYS; HEAT RESISTANT MATERIALS; HEAT RESISTING ALLOYS; HIGH ALLOY STEELS; IRON ALLOYS; IRON BASE ALLOYS; MATERIALS; MATHEMATICAL SOLUTIONS; MATHEMATICS; NICKEL ALLOYS; NUMERICAL SOLUTION; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; SIMULATION; STAINLESS STEELS; STEEL-CR19NI10; STEELS; TRANSITION ELEMENT ALLOYS