Thermal stress relaxation creep and microstructural evolutions of nano-structured SiC ceramics by liquid phase sintering
Creators
- 1. CEA Saclay, DEN DANS DMN SRMA, F-91191 Gif Sur Yvette (France)
- 2. Kyoto Univ, Inst Adv Energy, Kyoto 6110011, (Japan)
- 3. Muroran Inst Technol, Dept Mat Sci and Engn, Muroran, Hokkaido 0508585 (Japan)
Description
We explored the thermal relaxation creep characteristics of nano-structured SiC ceramics by bend stress relaxation (BSR) method. The effects of the differences in microstructure and secondary phases by liquid phase sintering at 1800 or 1900 C were especially discussed, based on microstructural evolutions during the creep. The creep was characterized by the BSR ratio (m) of ∼ 0. 80 up to 1200 C, and the proportion of amorphous phase as a secondary phase was related to the creep resistance at 1300 C. The microstructural evolutions during the creep consisted firstly in the re-distribution of amorphous phase, probably as a consequence of its viscous flow, and secondly in an extensive nucleation and growth of cavities. Furthermore, the former enhanced inter-diffusion of Al-Y among intergranular areas above the ternary eutectic temperature, which caused the significantly reduced creep resistance, and the latter reflected the crystalline YAG decomposition as another secondary phase near 1500 C. (authors)
Availability note (English)
Available from doi: http://dx.doi.org/10.1016/j.jeurceramsoc.2010.04.035Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of the European Ceramic Society
- Journal Volume
- 30
- Journal Issue
- no.12
- Journal Page Range
- p. 2643-2652
- ISSN
- 0955-2219
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- France
- INIS RN
- 42108358
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CREEP; GRAIN BOUNDARIES; HOT PRESSING; MICROSTRUCTURE; NANOSTRUCTURES; SILICON CARBIDES; SINTERING; THERMAL STRESSES
- Descriptors DEC
- CARBIDES; CARBON COMPOUNDS; FABRICATION; MATERIALS WORKING; MECHANICAL PROPERTIES; MICROSTRUCTURE; PRESSING; SILICON COMPOUNDS; STRESSES
Optional Information
- Notes
- 29 refs.